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Semiconductor wafer situation, more than 90% by the semiconductor industry import | observation
In recent years, the proportion of silicon wafers in the semiconductor market is basically stable, and the proportion is about 34%. In 2015, the global semiconductor wafer market was about 8 billion US dollars, accounting for the largest IC manufacturing materials.
Japan's Shin Etsu and Sumco sales accounted for more than 50%, Taiwan Chinese global wafer in 2016 has acquired Topsil and SunEdisonSemi, has become the world's third largest semiconductor chip suppliers, the top six wafer factory sales share reached 92%,.
the market has been the monopoly of semiconductor silicon wafer. Since 2016 the annual global DRAM and 3D NAND Flash shipments increased and the wafer capacity of large international companies, large size wafer project failed to add the mainland investment to achieve global semiconductor wafer shipments, led to tight supply, with several large silicon supplier capacity rate of 100% international forward.
The three semiconductor wafer factory were announced 2017 Q1 will raise 12 inch silicon prices from 10 to 20%. According to IC Insights statistics show that the global operations of the 12 inch (300mm) wafer factory number continues to grow in 2016 can reach 100, by the end of 2020, a total of 12 inch wafer factory application in IC the expected global production reached 117, if the 18 inch (450mm) wafer into mass production, the peak number of 12 inches the Fab can reach about 125.
The 12 inch (300mm) is mainly used in the production of silicon logic chip and memory chip, and DRAM and NAND flash memory and the next five years compound annual growth rate (CAGR) up to 7.3%, the output value will be amplified from $77 billion 300 million last year to $109 billion 900 million, the growth rate reached 42.2%, thus, the global demand for 300mm wafer will continued expansion.
It is expected that the shortage of silicon will be normal in the next few years. The domestic IC industry after 30 years development, has formed a certain scale of the industry, and the integrated circuit design, chip manufacturing, packaging and testing industry and supporting industry development relatively perfect industry chain pattern. At present, China's rapid development of the semiconductor industry, a higher level of upstream raw materials demand to maintain, in recent years on silicon and silicon based materials demand the basic level of around 13 billion yuan, but the 12 inch wafer is completely dependent on imports, so the future possibility of greater import substitute.
What is a semiconductor wafer Silicon wafer, also called silicon wafer, is an important material for making integrated circuit. By means of photolithography and ion implantation, the integrated circuit and various semiconductor devices can be made. Silicon wafer is a piece of material made of silicon. Its diameter is 6 inches, 8 inches, 12 inches and so on.
Monocrystalline silicon is a single crystal of silicon, it is a relatively lively non-metallic element, with the basic complete lattice structure. Different directions have different properties, and it is a good semiconducting material.
Purity requirements reached 99.9999%, and even reached 99.9999999%, the content of impurities dropped to 10-9 level. High purity polycrystalline silicon can be prepared by SIEMENS process, and then polycrystalline silicon is grown from the melt by Czochralski or floating zone melting method using polycrystalline silicon as raw material. Monocrystalline silicon wafers are divided into 6 inches, 8 inches, 12 inches and 18 inches, depending on their diameter. Silicon (Si) is the most important semiconductor material at present.
More than 95% of semiconductor chips and devices are produced by using silicon wafer as the base material. In the foreseeable future, no other material (such as graphene) can replace silicon. Silicon wafers of different sizes and sizes are widely used in the semiconductor manufacturing industry, usually including 4 inches, 5 inches, 6 inches, 8 inches and 12 inches, and their basic specifications are shown in the table below:
Comparison of direct drawing method and zone melting method The larger the wafer size, the more chips will be cut on each wafer in the future, and the cost per unit chip will be lower. In 1960, there were about 0.75 inches of silicon wafers about 20mm. Around 1965, when GordonMoore proposed Moore's law, the transistor was based on discrete devices, and then began to use a small amount of 1.25 inch small silicon, and then the 1.5 inch silicon wafer for integrated circuits was in great demand.
After that, it's 2 inches, 3 inches, and 4 inches. Next, 5 inches, 6 inches, 8 inches, and then go in 12 inches. The industry is recognized that 1980s is a 4 inch silicon wafer mainstream,.
1990s is 6 inches mainstream, 2000s is 8 inches mainstream, until 2002 when Intel and IBM first built 12 inch production line, by 2005 accounted for 20%, and in 2008 accounted for 30%, while 8 inches has dropped to 54% and 6 inches down to 11% . It is estimated that about 18 inches (450mm) of silicon will be put into use around 2020.